This position can be located in San Jose, CA or Fort Collins, CO
Responsibilities
- Support high data rate SerDes applications - up to 112Gbps NRZ and 224G PAM4 systems
- System level Signal and Power Integrity design trade-offs and debug
- Collaborate with package, PCB, and silicon designers to complete measurement-simulation correlation projects
- Develop models with electromagnetic field solvers: primarily with Ansys HFSS and electronic suite.
- Ability to understand laminate design and fabrication techniques and limitations for both package and PCB designs.
- Evaluate system, PCB and package material and connector solutions for future designs.
- Simulate schematic models and environments within Keysight ADS.
- Ensure and know trade-offs for the accuracy of models (3D/2.5D/2D) used for design simulations.
- Perform and develop VNA/TDR (50GHz+) measurement techniques and correlate with models and simulations.
- Provide feedback and learnings from measurement-simulation correlation investigations to improve best practices for modeling and simulations.
- Capture high fidelity lab measurements to be used for correlation and debug purposes
- Experience with sampling and real-time oscilloscopes, spectrum analyzers, and optical oscilloscopes.
Understand and apply:
- High speed data communications
- Transmission-line and electromagnetic-field theory
- Numerical analysis
- VNA/TDR measurements
- Bit-by-bit and Statistical simulators for serial data (SerDes) links
- Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams
- Work in either time domain or frequency domain
- Phase noise analysis as it applies to PLL's, reference clocks, SerDes TX-RX links
- Jitter sensitivity measurement and analysis for SerDes IP
- Organize and manage multiple projects
- Develop, clearly and effectively document, and track project plans
- Effectively communicate complex concepts in conversation, presentations and written documents
- Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom's internal performance goals
- Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)
- Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity
- Document and deliver SI models with supporting documentation to customer and internal engineers
- Support customer analysis and debug efforts related to our deliverables
- Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc
- Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).
- Power Integrity Concepts: PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.
Qualifications
- BS +8yrs, MS +6 yrs or PhD +3yrs Electrical Engineering or Physics and years' experience in one or more of:
- Signal integrity for high-speed digital applications
- Electromagnetic transmission line theory
- Microwave theory
- Numerical Field solver theory
- Power integrity
- IC package design
- Photonics
Tools
- EM modeling (Ansys HFSS/SIWave/Q3D and Polar)
- Circuit simulation tools (Keysight ADS)
- Matlab (desired)
- Cadence APD/Allegro (desired)
- Other layout tools (desired)
- Linux (desired)
- Keysight AEL (desired)
- Perl (desired)