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Lead mechanical and thermal design analysis of package, board and system configurations working closely with Package and System Architects to deliver industry leading products. Lead engineer to Design, test, analyze, qualify, and document mechanical hardware of moderate to high complexity. Participate in negotiating package and system design requirements with customers, vendors, and key stakeholders. Create concept, intermediate, and final designs with intermediate milestone peer review and empirical prototype evaluation. Develop Key Performance Indicators (KPI) for mechanical design features of package and system chassis to obtain optimal thermal and structural design. Create and communicate drawings, CAD models and other design collateral through BOM management. Participate in compliance testing with Nationally Recognized Test Labs in ensuring product meets all EMI/EMC and safety standards required. Lead and conduct root-cause-analysis and technical investigations for Package and Systems thermal and mechanical designs. Participate in cross-functional team efforts in integration, pre-qualification and qualification for products and sub-systems of moderate to high complexity. Provide assistance to creating technical roadmaps, establishing best practices, and determining product feasibility. Lead internal and external stakeholders (supplier/vendors) to deliver components that meet quality, cost, and timelines. Minimum Requirements Masters degree in Mechanical Engineering, or related field, or foreign degree equivalent, plus 4 years of experience in Mechanical Engineering, Product & System Design, Silicon Photonics, or Semiconductor. The experience which can be gained concurrently must also include the following: 4 years of experience using CAD tools (such as Solidworks, AutoCAD); 4 years of experience building mechanical design of semiconductor packaging technologies and system design; 4 years of experience performing Geometric tolerancing and analysis (GT&A); 3 years of experience working on complex projects with diverse scope with aggressive timelines; 3 years of demonstrated capabilities to think conceptually of advanced issues and deliver quality solutions; 1 year of experience in the semiconductor industry leading to knowledge of semiconductor packaging (2D/3D) technologies and system design as it relates to thermal and mechanical design; and 1 year of experience in design and manufacturing in the field of Silicon Photonics including laser, fiber attach processes, and optical fiber network management. Alternate requirements include: Bachelors degree in Mechanical Engineering, or related field, or foreign degree equivalent, plus 6 years of experience in Mechanical Engineering, Product & System Design, Silicon Photonics, or Semiconductor. The experience which can be gained concurrently must also include the following: 6 years of experience using CAD tools (such as Solidworks, AutoCAD); 6 years of experience building mechanical design of semiconductor packaging technologies and system design; 6 years of experience performing Geometric tolerancing and analysis (GT&A); 5 years of experience working on complex projects with diverse scope with aggressive timelines; 5 years of demonstrated capabilities to think conceptually of advanced issues and deliver quality solutions; 3 years of experience in the semiconductor industry leading to knowledge of semiconductor packaging (2D/3D) technologies and system design as it relates to thermal and mechanical design; and 3 years of experience in design and manufacturing in the field of Silicon Photonics including laser, fiber attach processes, and optical fiber network management. Occasional domestic or international travel to Boston, MA or Toronto, Canada offices. Job Location: Lightmatter, Inc., 800 W. El Camino Rd., Ste 350, Mountain View, CA 94040. (Telecommuting allowed 2-3 days per week within the same MSA.) 40 hours per week, 9:00 am 5:00 pm. Salary from $181,397 per year to $208,230 per year. Send resume and letter of application detailing experience to Ellen Schneider, Sr. HR Business Partner, Lightmatter, Inc.,
Date Posted: 21 February 2025
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