Solutions, missions to help customers, business partners, and employees achieve success through shared goals, strategies, resources and technology solutions.
Hyve Solutions is a leader in the data center solutions industry, designing, manufacturing, and delivering custom Server, Storage, and Networking Solutions to the world's largest Cloud, Social Media, and Enterprise companies. We pride ourselves on collaboration, innovation and thought leadership. Our team consists of diverse, forward-thinking individuals who dare to challenge the status quo, while working with many of the world's biggest customers. Hyve Solutions is a part of Synnex Corporation, a Fortune 500 company. Become part of a team that thrives on excellence in a fast changing, high-growth technology environment.
Hyve Solutions is looking for a detail-oriented, hands-on, results-driven individual with proven communication skills and a strong work ethic to work in a challenging, fast-paced, energetic environment.
Responsibilities include:
Primary:
- As part of Hyve's Technology Team, co-located in Portland OR, Taipei, and Fremont CA, you will join a small tightly-knit team that drives technology development and design execution that supports Hyve Solutions' CSP Datacenter Rack-Level Integration at Scale.
- Provide signal integrity technical leadership for Hyve's server products, which incorporate high-bandwidth, connectivity-intesive multi-core processor CPU/SOCs.
- Provide cross-functional leadership to define and deliver the signal integrity specifications for Hyve's server platforms, by working with external CSP customers, external component suppliers, hardware platform architects, hardware engineers, PD/SI/PI engineers, ME/Thermal engineers, firmware, product marketing teams, and especially by working with external customer-facing teams.
- Design/simulate/validate high performance interconnect solutions for Hyve's server products that achieve robust end-to-end signal integrity performance.
- Work with Hyve's design teams to optimize PCB parameters that impact HSIO performance (PCIe Gen6, DDR5). Develop SI test plans and methodologies to help simulate, validate, and characterize system-level design implementations to ensure compliance to these specifications.
- Work with platform team to develop, bring-up, and validate the designs to meet product requirements.
- Prepare documentation and engineering release package for the electrical designs.
- Within these primary roles, the successful candidate will immediately commence driving signal integrity engineering for:
DDR5 development activities to support Tier-1 CSP (compute) including POC development
PCIe Gen6 development activities to support Tier-1 CSP (compute)
PCIe Gen6 development activities to support Tier-1 CSP (storage)
Secondary:
- This is a customer-facing role, and requires strong English communication skills, both written and verbal. Requires strong problem solving, documentation and organizational skills.
- Comfortable working in a very collaborative cross-Geo team working environment.
- Provide engineering support for CSP customers' questions related to platform architecture and design.
- Drive technology development activities to enable Hyve's next-gen server platforms.
- Hyve IP projects: supports customer inquiry feasibility for design concept before RFQ/RFP.
HYVE Solutions, we believe employees are our greatest asset and we empower them to make a difference in our business. Diversity and inclusion make us all better. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Date Posted: 07 April 2025
Apply for this Job