Product Lead

ASIC design, semiconductor electronics, mixed-signal, chiplet design, advanced packaging, chiplet integration, high-speed chiplet, signal & power integrity If you post this job on a job board, please do not use company name or salary. Experience level: Mid-senior Experience required: 9 Years Education level: Bachelors degree Job function: Information Technology Industry: Information Technology and Services Pay rate : View hourly payrate Total position: 1 Relocation assistance: No Visa sponsorship eligibility: No JOB DESCRIPTION Product Lead - Advanced Semiconductor Packaging and Integration Position Overview: We are seeking a highly experienced candidate with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging. Responsibilities: Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs. Collaborate with cross-functional teams to innovate and integrate mixed-signal and chiplet designs. Drive advancements in chiplet integration and high-speed chiplet I/O. Ensure signal and power integrity throughout the design and implementation phases. Stay abreast of the latest trends and technologies in advanced packaging and semiconductor processing. Requirements: Bachelors or Masters degree in Electrical Engineering, Computer Engineering, or a related field. At least 10 years of experience in semiconductor electronics and ASIC design. Proficiency in mixed-signal design and chiplet design. In-depth knowledge of advanced packaging, BEOL and FEOL semiconductor processing. Experience with current packaging technologies and substrate technologies for advanced packaging. Strong expertise in chiplet integration and high-speed chiplet I/O. Proven track record in ensuring signal integrity and power integrity in complex designs. Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects. Mentor and guide junior engineers, fostering a culture of continuous learning and innovation. Preferred Qualifications: Ph.D. in a relevant field. Experience with leading industry-standard design and simulation tools. Published works or patents in semiconductor technologies. Excellent leadership, communication, and project management skills.