Principal Engineer
USA
Up to $300 + Bonus & Benefits
A highly strategic and hands-on, suited for someone used to owning the technical roadmap for breakthrough hardware requiring cross-functional leadership and delivering a complex, first-of-its-kind hardware-software system.
The successful candidate will be the technical lead for a flagship product, shaping everything from architecture and prototyping through to engineering design and handoff to manufacturing.
This is a flagship build: from concept to commercial deployment. You'll architect and direct the technical execution across multiple engineering domains. The role spans physics, hardware, software, and system integration - with full technical ownership.
You'll collaborate across disciplines - physics, optics, systems, software, electronics, cryogenics - and work in close alignment with product and program management to translate business goals into tangible technical outcomes.
What You'll Drive:
- End-to-end technical direction of a next-gen quantum system
- Engineering roadmap ownership across the full product lifecycle
- Design reviews, risk management, and decision-making frameworks
- Systems-level design integration and validation strategies
- Close alignment with internal R&D and external partners on roadmap delivery
Candidate Background:
- 15+ years delivering complex, high-precision, first-in-class systems
- Proven leadership in high-growth, high-tech environments
- Systems engineering depth across multiple domains (e.g. optical, thermal, RF, embedded)
- Strong communication and strategic decision-making skills
- Mechanical + electrical design of the core substrate or chip, including materials engineering, integration pathways, and miniaturization.
- Precision optics, beam alignment, photonic interfacing - used for control, measurement, and readout of qubit systems.
- Development of RF, signal generation, FPGA-based control systems for high-fidelity real-time execution.
- Design of enclosures, thermal regulation, and noise shielding; includes vibration isolation and vacuum/thermal considerations.
- Design of the full mechanical enclosure - form factor, isolation systems, deployment-readiness.
- Building the V&V frameworks, embedded test points, calibration feedback, and automated diagnostics.
- Integration with cloud platforms, compilers, and control stacks - ensuring full-stack operability and orchestration readiness.