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In this role you will be responsible for:
Active circuit design as well as technical leadership.
Design leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry leading products.
Develop transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
Design of hi-performance broadband analog circuits for optical front-end receivers.
Design of various other analog circuits including linear regulators, AGC loop, current/voltage sensors, bandgaps etc.
Develop microarchitecture of chips and major circuit blocks and guide a team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.
Work with other functional groups to drive post-silicon validation, qualification, transition to mass production, and customer support.
Work with management and marketing to define parts and translate the specifications and definitions into circuit implementation
What We're Looking For
Bachelors degree in Electrical Engineering in the areas of design of high-performance RF/Analog Receiver/TIA design and 15+ years experience Or MSc EE 10-12+ Or PhD EE with 10+ years of experience in the areas of design of high-performance RFAnalog Receiver/TIA design.
Proven experience in IC design including chip tape-out AND lab evaluation of receiver design working in the industry). Solid experience in.
Using EDA CAD tools
Performing Analog Custom Layout
Experience in measuring IC performance and debug of design to correlate simulations to measurements
Deep understanding of fundamentals, including:
Detailed transistor level design
Device physics
Control/Feedback loop stability analysis
Direct project experience in at least one of the following areas is a plus:
AGC loop design
High precision analog circuits (Including linear regulators, current sensors, bandgaps and DAC/ADC)
Experience in CTLE design
Experience in Package-System integration issues desired
Project experience in using different technologies. (SiGe BiCMOS is a plus)
A team-player
Experience in the following is needed:
Proven leadership and experience in working with multidisciplinary teams & projects
Experience as chip lead with success in silicon
Experience in taking chips to mass production
Ability to translate chip level specifications into architecture
Experience in the following is a strong plus:
Overseeing and mentoring junior circuit designers
Willingness to share knowledge with other team members.
Strong communication, presentation and documentation skills.
Date Posted: 24 March 2024
Job Expired - Click here to search for similar jobs