Principal RF Engineer / Sr

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Northrop Grumman Mission Systems (NGMS) Advanced Capabilities division is leading the development of the next generation of high-performance computing. Superconducting electronics forms the core of our technology, with a focus on energy-efficient computation using our patented superconducting digital logic technology, Reciprocal Quantum Logic (RQL). On a gate-for-gate basis, RQL consumes orders of magnitude less power than CMOS while running at significantly higher clock speeds. The Advanced Capabilities division is seeking experienced RF Engineers to join our team and develop these technologies into high-performance computing systems. You'll work in a fast-paced team environment alongside physicists, design engineers, and superconducting foundry engineers to make these technologies a reality. How you will contribute to the Mission: Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies
Support verification efforts for RF, Analog, and Digital hardware designs
Collaborating with peer functions such as Mechanical, Manufacturing, Test, and IC design Engineers
Deriving and trading requirements with subsystem engineers and component level designers
Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements This position will serve on-site in Linthicum, MD or Annapolis Junction, MD. This position will be filled at either the Principal RF Engineer or Sr. Principal RF Engineer level based on the qualifications below. Basic Qualifications for the Principal RF Engineer Level:
Bachelor's degree in Electrical Engineering or related STEM degree and 5 years of relevant work experience required. Master's degree and 3 years of experience
Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)
Experience working with software programing languages
Prior experience working with electronics, mechanical requirements, and schematic drawings
Hands on experience utilizing test instrumentation such and power supplies, network analyzers, Oscilloscopes, spectrum analyzers, High speed digital IO
Ability to obtain and maintain a U.S. Top Secret/SCI with Poly Security Clearance for which US Citizenship is a requirementBasic Qualifications for the Sr. Principal RF Engineer Level:
Bachelor's degree in Electrical Engineering or related STEM degree and 9 years of relevant work experience required. Master's degree and 7 years of experience
Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)
Experience working with software programing languages
Prior experience working with electronics, mechanical requirements, and schematic drawings
Hands on experience utilizing test instrumentation such and power supplies, network analyzers, Oscilloscopes, spectrum analyzers, High speed digital IO
Ability to obtain and maintain a U.S. Top Secret/SCI with Poly Security Clearance for which US Citizenship is a requirementPreferred Qualifications:
Well versed in working with Ansys HFSS modeling for RF packaging effects
Experience with spectrum and network analyzer techniques for EMC measurements
Prior experience with packaging technologies ( e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.) Experience with Cryogenic test stands, superconductivity and mechanical CTE Active U.S. Top Secret/SCI with Poly highly preferred Salary Range: $102,400 - $153,600
Salary Range 2: $127,000 - $190,600 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit . U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.