Multi-Disciplined Electronic/Acoustical Engineer or Principal Multi

Annapolis, Maryland

Northrop Grumman
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Requisition ID: R
  • Category: Engineering
  • Location: Annapolis, Maryland, United States of America
  • Clearance Type: Secret
  • Telecommute: No- Teleworking not available for this position
  • Shift: 1st Shift (United States of America)
  • Travel Required: Yes, 10% of the Time
  • Relocation Assistance: Relocation assistance may be available
  • Positions Available: 1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Mission Systems is seeking a Multi-Disciplined Electronic/Acoustical Engineer or Principal Multi-Disciplined Electronic/Acoustical Engineer - with hands-on experience and duties of a micro-electronics lab technician to join its Dolphin Works Sonar Innovation Lab in Annapolis, Maryland.

In this position the candidate will perform a variety of tasks supporting a team of engineers in the research, development, fabrication, test, deployment, and servicing of a fleet of sonar systems on various sized platforms from small man portable UUVs to manned submarines. The technician will enable early-stage research and development by assembling and testing prototype circuits, transducers and fixtures including surface mount electronics, wiring assemblies and composite material transducers in preparation for ATF (Acoustic Test Facility) and on water tests. They will also support the team by recommending design, fabrication, and resiliency improvements. This will involve critical analysis using a suite of lab equipment including X-Ray, microscopes, and thermal imaging cameras in support of periodic RCCA investigations (Root Cause Corrective Action). The candidate will also track calibration of test equipment, material handling and general safety throughout the lab in cooperation with lab management.

The selected candidate will provide technical support to engineers on technical tasks in the R&D development environment. The selected candidate should thrive in a fast-paced work environment with high expectations, significantly diverse assignments, collaborative/team settings across all levels. The successful candidate will bring knowledge of major process technologies including hardening and ruggedization and an emphasis on packaging and assembly, risk management, failure analysis/ rework procedures/ capabilities on complex electronics and microminiature components and systems, as well as modification for reliability, ruggedization, and deep ocean pressure tolerance to support current development and production efforts.

This position can be filled as a Multi-Disciplined Electronic/Acoustical Engineer or Principal Multi-Disciplined Electronic/Acoustical Engineer.

Basic Qualifications for aMulti-Disciplined Electronic/Acoustical Engineer:
  • Bachelor's Degree in a STEM discipline (Science, Technology, Engineering, Math) with 2 years of relevant experience; 0 years' experience with a Master's Degree.
  • Surface mount soldering certification or extensive demonstrated knowledge and skill in surface mount circuit board assembly, fabrication, and repair.
  • Ability to read and interpret electrical schematics and mechanical drawings, as well as provide review and propose suggested improvements to same.
  • Extensive knowledge of electronics, circuit theory and hybridized electronic packaging.
  • A high degree of skill in fabrication, repair, and test of complex components, assemblies, devices, circuits, and systems.
  • Experience performing assembly and test on subsystems and/or subassemblies in a lab environment.
  • Experience providing technical assistance to engineering personnel for product and process development.
  • U.S. Citizen with ability to obtain and maintain a Secret Security Clearance.
Basic Qualifications for a PrincipalMulti-Disciplined Electronic/Acoustical Engineer:
  • Bachelor's Degree in a STEM discipline (Science, Technology, Engineering, Math) with 5 years of relevant experience; 3 years' experience with a Master's Degree.
  • Surface mount soldering certification or extensive demonstrated knowledge and skill in surface mount circuit board assembly, fabrication, and repair.
  • Ability to read and interpret electrical schematics and mechanical drawings, as well as provide review and propose suggested improvements to same.
  • Extensive knowledge of electronics, circuit theory and hybridized electronic packaging.
  • A high degree of skill in fabrication, repair, and test of complex components, assemblies, devices, circuits, and systems.
  • Experience performing assembly and test on subsystems and/or subassemblies in a lab environment.
  • Experience providing technical assistance to engineering personnel for product and process development.
  • U.S. Citizen with ability to obtain and maintain a Secret Security Clearance.
Preferred Skills and Qualifications:
  • Experience fabricating sonar transducers and custom digital and analog circuits.
  • Participate in the safe execution of tasks required in support of research and development and production for commercial, military, and classified programs as the demand requires.
  • Implement design and process engineering for the manufacture of complex, hybridized packaging, including development of processes for injection molding and encapsulation, hybrid packaging assembly, PCB surface mount technology, and materials testing.
  • Knowledge of production equipment, and raw materials used (chemicals, metals, polymers, composites, etc.), process monitoring and control, process development and documentation, routine equipment maintenance requirements, and industry standards and trends.
  • Familiar with Lab equipment setup and operation of, but not limited to: X-Ray machine, wire bonder, BGA re-work apparatus, measuring microscope, batch ovens, hyperbaric chamber, etc.
  • Provide research for procurement and installation of process and analysis equipment - requiring special consideration and understanding of the materials, processes, the operating environment, and the raw materials used.
  • Able to ensure delivered products meet company quality standards, consist of the latest technology, and are manufactured according to detailed/ specific process instructions. This requires knowledge of major process technologies, expected results of these processes, risk management, failure analysis/rework procedures and capabilities, time analysis of processes for scheduling purposes and reporting of project status to customer.
  • Oversee junior engineers and technicians involved in packaging of hybrid electronics, providing mentoring, guidance, and training as needed in a fast-paced development environment.
  • Interface with other departments as SME to resolve problems.
  • Take part in corrective actions and process changes as well as cost improvement initiatives.
Competencies for Success:
  • Adapt readily to changing assignments and requirements in a team first, fast paced, mission focused environment - multitasking and prioritizing with flexibility.
  • Positive individual who is willing to expand current skill set through schooling and training.
  • Strong interpersonal communication skills with ability to work with others at all levels and across a high performing organization.
  • Strong attention to detail and accuracy
Salary Range: $75,700 - $113,500
Salary Range 2: $93,000 - $139,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S . click apply for full job details
Date Posted: 23 May 2024
Job Expired - Click here to search for similar jobs